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ILX137K
10700-pixel x 6-line CCD Linear Sensor (Color)
Description The ILX137K is a reduction type CCD linear sensor developed for color image scanner. This sensor reads A4-size documents at a density of pseudo 2400DPI. Features * Number of effective pixels: 64200 pixels (10700 pixels x 6) * Pixel size: 2.4m x 4m (4m pitch) * Distance between line: 2 lines between the same color (8m) 16 lines between different colors (64m) * On-chip microlens Cylindrical lens (width 6m) * Single-sided readout * Supply voltage: Single 12V power supply * Input clock pulse: CMOS 5V drive * Number of output: 3 (R, G, B) * Package: 24-pin Plastic-DIP Absolute Maximum Ratings * Supply voltage VDD * Input clock voltage * Operating temperature * Storage temperature 24 pin DIP (Plastic)
Pin Configuration (Top View)
2 1L' 4 GND VOUT-R VOUT-G
1 1 1 1 1 1
1 2 3 4 5 6
24 23 22 21 20 19
1 2L 3 RS VDD VOUT-B
15 7 -10 to +60 -30 to +80
V V C C
NC NC GND
7 8 9
R (Sub) R (Main) G (Sub) G (Main) B (Sub) B (Main)
18 17 16 15 14
NC NC 1 2 ROG-G VDD
ROG-B 10 ROG-R 11
Sony reserves the right to change products and specifications without prior notice. This information does not convey any license by any implication or otherwise under any patents or other right. Application circuits shown, if any, are typical examples illustrating the operation of the devices. Sony cannot assume responsibility for any problems arising out of the use of these circuits.
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E01651-PS
10700 10700 10700 10700 10700 10700
NC 12
13
Block Diagram
VDD 20
4 3
1L' 2
VDD 13
2 1
2 15
CCD register
S10700
Main Line (Blue)
D104
D66
D82
D83
S1
S2
S3
VOUT-B 19
S10700'
Driver Sub Line (Blue) CCD register
OFD
D104' D66' D82' D83' S1' S2' S3'
10 ROG-B
CCD register
S10700
Main Line (Green)
D104
D66
D82
D83
S1
S2
S3
S10700'
Sub Line (Green) CCD register
OFD
CCD register
S10700
Main Line (Red)
D104
D66
D82
D83
S1
S2
S3
D104'
D66'
D82'
D83'
S1'
S2'
S3'
S10700'
Sub Line (Red) CCD register
OFD
4
21
22 3
23 2L
9 GND
16 1
D104'
D66'
D82'
D83'
S1'
S2'
S3'
-2-
VOUT-G
6
Driver
14 ROG-G
VOUT-R
5
Driver
11 ROG-R
24 1
GND RS
ILX137K
ILX137K
Pin Description Pin No. 1 2 3 4 5 6 7 8 9 10 11 12 Symbol 2 1L' 4 GND VOUT-R VOUT-G NC NC GND ROG-B ROG-R NC Description Clock pulse input Clock pulse input Clock pulse input GND Signal output (red) Signal output (green) NC NC GND Clock pulse input Clock pulse input NC Pin No. 13 14 15 16 17 18 19 20 21 22 23 24 Symbol VDD ROG-G 2 1 NC NC VOUT-B VDD RS 3 2L 1 Description 12V power supply Clock pulse input Clock pulse input Clock pulse input NC NC Signal output (blue) 12V power supply Clock pulse input Clock pulse input Clock pulse input Clock pulse input
Recommended Supply Voltage Item VDD Min. 11.4 Typ. 12.0 Max. 12.6 Unit V
Input Pin Capacitance Item Input capacitance of 1, 2 Input capacitance of 1L', 2L Input capacitance of 3, 4 Input capacitance of RS Input capacitance of ROG Symbol C1, C2 C1L', C2L C3, C4 CRS CROG Min. -- -- -- -- -- Typ. 2350 20 20 10 10 Max. -- -- -- -- -- Unit pF pF pF pF pF
ROG represents ROG-R, ROG-G and ROG-B. Clock Frequency Item 1, 2, 1L', 2L 3, 4 RS f3, f4 fRS Symbol f1, f2, f1L', f2L Min. -- -- -- Typ. 1 2 2 Max. 6 6 6 Unit MHz MHz MHz
Input Clock Voltage Conditions Item 1L', 2L, 3, 4 1, 2, RS, ROG High level Low level High level Low level Min. 4.75 0 4.75 0 -3- Typ. 5.0 -- 5.0 -- Max. 5.25 0.1 5.25 0.5 Unit V V V V
ILX137K
Electro-optical Characteristics (Note 1) Ta = 25C, VDD = 12V, fRS = 2MHz, Input clock = 5Vp-p, Light source = 3200K, IR cut filter CM-500S (t = 1.0mm) Item Red Sensitivity Sensitivity nonuniformity Adjacent pixel difference Saturation output voltage Overflow exposure Red Saturation exposure Dark voltage average Dark signal nonuniformity Image lag Current consumption Total transfer efficiency Output impedance Offset level Offset level difference Green Blue Green Blue Symbol RR RG RB PRNU PDF VSAT OE SER SEG SEB VDRK DSNU IL IVDD TTE ZO VOS VOS Min. 0.62 0.81 0.54 -- -- 1 3 x SEmin -- -- -- -- -- -- -- 92 -- 5.0 -- Typ. 0.96 1.25 0.84 4 4 1.5 -- 1.56 1.20 1.79 0.1 0.6 0.02 18 98 300 6.5 -- Max. 1.30 1.69 1.14 18 16 -- -- -- -- -- 2.0 4.0 -- 35 -- -- 8.0 100 mV mV % mA % V mV Note 8 Note 9 Note 10 -- -- -- Note 11 Note 12 lx . s Note 7 % % V Note 3 Note 4 Note 5 Note 6 V/(lx . s) Note 2 Unit Remarks
Notes) 1. For each color, the black level of Main Line is defined as the average value of D66, D67 to D81, and the black level of Sub Line is defined as the average value of D66', D67' to D81'. The following electro-optical characteristics signal processing is performed. 2. For the sensitivity test light is applied with a uniform intensity of illumination. 3. PRNU is defined as indicated below. Ray incidence conditions are the same as for Note 2. VOUT = 500mV (Typ.) PRNU = (VMAX - VMIN)/2 VAVE x 100 [%]
Where the maximum output of the effective pixels is set to VMAX, the minimum output to VMIN and the average output to VAVE. 4. PDF = (VMAX/VAVE) x 100 [%] Here, VAVE is defined as the average output, and VMAX, the maximum value of Vi in the range of the following pixel. Red, green, blue pixel arrangement PDF is when i = 1 to 10699. However, the definition of Vi is as follows. Vi = ABS {VOUT (i) - VOUT (i + 1)} VOUT (i) is signal output of an effective pixel (i pixel) and VOUT (i + 1) is of the adjacent pixel (i + 1 pixel). -4-
ILX137K
5. Specifies at the minimum value of the saturation output voltage. 6. SEmin is the exposure at the minimum value (1V) of the saturation output voltage. 7. Saturation exposure is defined as in the following figure for each color. SE = VSAT/R 8. For each color, Main Line is defined by the difference between the average value of D2 to D64 dummy signal during no incident light and of D66 to D82, S1 to S700. Sub Line is defined by the difference between the average value of D2' to D64' dummy signal during no incident light and of D66' to D82', S1' to S10700'. Optical signal integration time int stands at 20ms. 9. For each color, calculate the difference as follows; the maximum and minimum values of the dark output voltage of respective Main Line and Sub Line; the dark voltage average value of respective Main Line and Sub Line. Then, the highest value is defined as dark signal nonuniformity. Optical signal integration time int stands at 20ms. 10. VOUT = 500mV (Typ.) 11. Vos is defined as the output DC value when RS is high. 12. For each color, the Main Line offset level of the optical black pixel is defined as Vos-main, the Sub Line offset level, Vos-sub. Then, the offset level difference is defined as indicated below. Vos = | Vos-main - Vos-sub |
Vos
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Clock Timing Chart 1 (Using both Main Line and Sub Line)
ROG
5 0
1 2 2 3
1, 1L' 2, 2L
5 0 5 0
3
5 0
4
5 0
RS
5 0
1
S10700'
S10700'
S10700
D103'
VOUT
Optical black (16 pixels x 2) Dummy signal (82 pixels x 2) Effective pixel signal (10700 pixels x 2) 1-line output period Dummy signal (22 pixels x 2)
Note) The transfer pulse 1, 2, 1L' and 2L must have more than 10805 cycles. 3 and 4 must have more than 21610 cycles.
D104'
D104
D65'
D66'
D82'
D83'
D65
D66
D82
D83
D1'
S1'
D1
D2
S1
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ILX137K
Clock Timing Chart 2 (Using only Main Line)
ROG
5 0
1
2
3
1, 3 2, 4, 2L
5 0 5 0
RS
5 0
1L'
0V
4
S10699
S10700
D76
D77
D78
D91
D92
D93
D94
VOUT
Optical black (16 pixels) Dummy signal (93 pixels) Effective pixel signal (10700 pixels) 1-line output period Note) The transfer pulse 1, 2, 1L', 2L, 3 and 4 have must more than 10816 cycles. Dummy signal (22 pixels)
D95
D1
D2
D3
S1
S2
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ILX137K
ILX137K
Clock Timing Chart 3
t4 t5
ROG t6 1 2 t7 t6 t1 t2 t7 t3
Clock Timing Chart 4
t7 1 t6 2 t9 1L' t8 2L t15 t11 3 t10 t18 t16 t19 t9 t8 t7 t6
4 t10 t17 RS t14 t21 VOUT Main Line t22 t20 Sub Line t11 t12 t13
1, 2, 1L' and 2L Cross Point
1, 1L' 5V 2, 2L 0V (1.5V and above) (1.5V and above)
3 and 4 Cross Point
3 4 5V 0V (1.5V and above) (1.5V and above)
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ILX137K
Clock Pulse Recommended Timing Item ROG, 1 pulse timing ROG pulse high level period ROG, 1 pulse timing ROG pulse rise time ROG pulse fall time 1 pulse rise/2 pulse fall time 1 pulse fall/2 pulse rise time 1L' pulse rise/2L pulse fall time 1L' pulse fall/2L pulse rise time 3 pulse rise/4 pulse fall time 3 pulse fall/4 pulse rise time RS pulse rise time RS pulse fall time RS pulse high level period 1L', 2L - 3, 4 pulse timing 1 1L', 2L - 3, 4 pulse timing 2 RS, 3 pulse timing 3, 4 pulse low level period Symbol t1 t2 t3 t4 t5 t6 t7 t8 t9 t10 t11 t12 t13 t14 t15 t16 t17 t18 t19 t20 Signal output delay time t21 t22 The recommended duty of 1, 2, 1L', 2L, 3 and 4 = 50%. 1 These timing is the recommended condition under fRS = 2MHz. Min. 50 100 1200 0 0 0 0 0 0 0 0 0 0 20 0 35 50 35 35 -- -- -- Typ. 100 -- 1500 5 5 20 20 10 10 10 10 10 10 1001 40 2101 1251 250 250 30 10 30 Max. -- -- -- 30 30 60 60 301 301 301 301 301 301 -- -- -- -- -- -- -- -- -- Unit ns s ns ns ns ns ns ns ns ns ns ns ns ns ns ns ns ns ns ns ns ns
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Application Circuit
1
IC1
2L
3
RS VOUT-B IC2
1k Tr1 100
ROG-G IC2 100
2
51
30
10
24
23
22
21
20
19
18
17
16
15
14
13
3
RS
VDD
VOUT-B
GND
1L'
ROG-R
ROG-B
VOUT-G
VOUT-R
GND
NC
NC
ROG-G
2
12V
4
1
2
3
4
5
6
7
8
9
10
11
12
0.1F
47F/ 16V
2
51
30 100 IC2 Tr1 Tr1 VOUT-G 1k ROG-B ROG-R 100 100 IC2 VOUT-R 1k 100
1L'
4
IC1
IC1: 74AC04 IC2: 74HC04 Tr1: 2SC2785
2
NC
VDD
NC
NC
1
1
2L
2
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ILX137K
Application circuits shown are typical examples illustrating the operation of the devices. Sony cannot assume responsibility for any problems arising out of the use of these circuits or for any infringement of third party patent and other right due to same.
ILX137K
Notes of Handling 1) Static charge prevention CCD image sensors are easily damaged by static discharge. Before handling be sure to take the following protective measures. a) Either handle bare handed or use non chargeable gloves, clothes or material. Also use conductive shoes. b) When handling directly use an earth band. c) Install a conductive mat on the floor or working table to prevent the generation of static electricity. d) Ionized air is recommended for discharge when handling CCD image sensor. e) For the shipment of mounted substrates, use boxes treated for prevention of static charges. 2) Notes on Handling CCD Packages The following points should be observed when handling and installing packages. a) Remain within the following limits when applying static load to the package: (1) Compressive strength: 39N/surface (Do not apply load more than 0.7mm inside the outer perimeter of the glass portion.) (2) Shearing strength: 29N/surface (3) Tensile strength: 29N/surface (4) Torsional strength: 0.9Nm
Cover glass Plastic portion 39N 29N 29N 0.9Nm
Ceramic portion (1)
Adhesive (2) (3) (4)
b) In addition, if a load is applied to the entire surface by a hard component, bending stress may be generated and the package may fracture, etc., depending on the flatness of the ceramic portion. Therefore, for installation, either use an elastic load, such as a spring plate, or an adhesive. c) Be aware that any of the following can cause the package to crack or dust to be generated. (1) Applying repetitive bending stress to the external leads. (2) Applying heat to the external leads for an extended period of time with soldering iron. (3) Rapid cooling or heating. (4) Prying the plastic portion and ceramic portion away at a support point of the adhesive layer. (5) Applying the metal a crash or a rub against the plastic portion. Note that the preceding notes should also be observed when removing a component from a board after it has already been soldered. d) The notch of the plastic portion is used for directional index, and that can not be used for reference of fixing. In addition, the cover glass and seal resin may overlap with the notch or ceramic may overlap with the notch of the plastic portion.
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ILX137K
3) Soldering a) Make sure the package temperature does not exceed 80C. b) Solder dipping in a mounting furnace causes damage to the glass and other defects. Use a 30W soldering iron with a ground wire and solder each pin in less then 2 seconds. For repairs and remount, cool sufficiently. c) To dismount an imaging device, do not use a solder suction equipment. When using an electric desoldering tool, ground the controller. For the control system, use a zero cross type. 4) Dust and dirt protection a) Operate in clean environments. b) Do not either touch glass plates by hand or have any object come in contact with glass surfaces. Should dirt stick to a glass surface, blow it off with an air blower. (For dirt stuck through static electricity ionized air is recommended.) c) Clean with a cotton bud and ethyl alcohol if the glass surface is grease stained. Be careful not to scratch the glass. d) Keep in a case to protect from dust and dirt. To prevent dew condensation, preheat or precool when moving to a room with great temperature differences. 5) Exposure to high temperatures or humidity will affect the characteristics. Accordingly avoid storage or usage in such conditions. 6) CCD image sensors are precise optical equipment that should not be subject to mechanical shocks.
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Package Outline
Unit: mm
24Pin DIP ( 400mil )
55.7 0.3 7.4 0.3 24 42.8 ( 4m x 10700Pixels ) 13
10.0 0.3
V
5.0 0.3
1 (8.893)
12
4.0 0.5
3.58
1.778
5.334
0.46 0.3 M
PACKAGE STRUCTURE
PACKAGE MATERIAL LEAD TREATMENT LEAD MATERIAL PACKAGE MASS DRAWING NUMBER
Sony Corporation
1. The height from the bottom to the sensor surface is 2.38 0.3mm. 2. The thickness of the cover glass is 0.7mm, and the refractive index is 1.5.
Plastic, Ceramic GOLD PLATING 42 ALLOY
5.43g
LS-B36(E)
4.28 0.5
0.25
H
No.1Pixel ( Main Green )
10.16
0 to 9
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ILX137K

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